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Optimization of x-ray lithography conditions for fabrication of large arrays of high-aspect-ratio submicron pores
Journal of Micromechanics and Microengineering ( IF 2.4 ) Pub Date : 2021-04-13 , DOI: 10.1088/1361-6439/abf331
V Nazmov 1, 2 , B Goldenberg 1 , A Vasiliev 3 , V Asadchikov 3
Affiliation  

Patterning using a focused ionizing radiation beam provides a high spatial resolution but is not feasible when creating large arrays of microstructures. We propose the optimization of x-ray lithography parameters to create submicropores in a low-sensitivity material (polyethylene terephthalate) using a wide x-ray beam. This optimization results in the fabrication of regularly arranged micropores with a high aspect ratio (over 20) and diameters of up to 0.4 m across a large substrate area (up to several square centimeters).



中文翻译:

用于制造大阵列高纵横比亚微米孔的 X 射线光刻条件优化

使用聚焦电离辐射束进行图案化提供了高空间分辨率,但在创建大型微结构阵列时不可行。我们建议优化 X 射线光刻参数,以使用宽 X 射线束在低灵敏度材料(聚对苯二甲酸乙二醇酯)中创建亚微孔。这种优化导致制造具有高纵横比(超过 20)和直径高达 0.4 的规则排列的微孔m 跨越大基板区域(最多几平方厘米)。

更新日期:2021-04-13
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