The present investigation is concerned with the study of two-dimensional deformation in an infinite semiconducting plate of uniform thickness bordered with inviscid liquid half-spaces. The plate is under the influence of the mechanical force of constant magnitude. The analytical expressions of displacement components, stress components, temperature distribution, and carrier density are obtained by normal mode analysis. The numerical results are presented graphically to show the effect of the thermoelectric coupling parameter and plate thickness on the physical components.

中文翻译：

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光热理论与不粘液体半空间相接的半导体板的分析

目前的研究是关于在无限厚的，具有均匀的液体半空间边界的无限半导体板中的二维变形的研究。板受到恒定大小的机械力的影响。通过正态分析获得了位移分量，应力分量，温度分布和载流子密度的解析表达式。数值结果以图形方式显示，以显示热电耦合参数和板厚对物理组件的影响。