To obtain the great surface quality of Ti–6Al–4V and achieve high efficiency in the polishing process, the chemistry enhanced shear thickening polishing (C-STP) was proposed, and the polishing performance of different pH slurry was studied. The results show that the material removal rate gradually increases as the pH value decreases from 10 to 1, and the best surface quality is obtained at pH 2. The corrosion current density and potential were measured by potentiodynamic polarization under three typical pH values. It is confirmed that the most massive corrosion rate presents at pH 2, and the passive film is most susceptible to be produced at pH 10. The reaction resistance was measured by electrochemical impedance spectroscopy to clarify the polishing mechanism. Under acidic conditions, the chemical reaction product on the surface can be quickly removed by mechanical action of the abrasive. On the contrary, the passive film formed on the surface under the alkaline condition is difficult to be removed. The corrosion reaction products were determined by X-ray photoelectron, and the chemical reaction under acid-base environment was derived. MRR reached 107.3 nm/min under the selected process parameters, and the surface roughness (S_a) is reduced from 124 nm to 8.6 nm within 15 min.

为了获得优质的Ti-6Al-4V表面质量并在抛光过程中达到较高的效率，提出了化学增强剪切增稠抛光（C-STP），并研究了不同pH浆料的抛光性能。结果表明，随着pH值从10降低到1，材料去除率逐渐提高，在pH 2时可获得最佳表面质量。在三个典型pH值下，通过电位动力极化法测量了腐蚀电流密度和电势。可以确定的是，最大腐蚀速率出现在pH值为2时，而钝化膜最容易在pH值为10时产生。反应阻抗通过电化学阻抗谱法进行测量，以阐明抛光机理。在酸性条件下 表面上的化学反应产物可以通过磨料的机械作用迅速去除。相反，在碱性条件下在表面上形成的钝化膜难以除去。用X射线光电子法测定了腐蚀反应产物，推导了在酸碱环境下的化学反应。在选定的工艺参数下，MRR达到107.3 nm / min，表面粗糙度（S _a）在15分钟内从124 nm减小到8.6 nm。