A proposal is made in this paper to realize 3-ways chip to chip communication via 3D photonic structure. The mechanism of the work is understood with the help of absorbance and reflectance of the structure. The absorbance is determined using the analytical treatment where reflectance is computed using the photonic bandgap analysis, which is found with the help of plane wave expansion method. Further the present research deals with low power input signal whose potential varies from 0.55 to 1 V because to avoid the heat generation in nanoelectronics and nanophotonic circuits where circuit comprises chip, LED and photo detector along with waveguide (3D photonic structure). The output results indicate that a proper combination of lattice spacing of silicon-based 3D photonic structure and diameter of air holes could be a right candidate to realise 3-ways communication.

本文提出了通过 3D 光子结构实现 3 路芯片到芯片通信的建议。借助结构的吸收率和反射率可以了解工作原理。使用分析处理确定吸光度，其中使用光子带隙分析计算反射率，这是借助平面波展开方法找到的。此外，目前的研究涉及电位从 0.55 到 1 V 变化的低功率输入信号，因为以避免纳米电子和纳米光子电路中的热量产生，其中电路包括芯片、LED 和光电探测器以及波导（3D 光子结构）。