We report on buckling structures observed on tantalum films deposited by sputtering on silicon wafers. It is shown that, above a critical diameter, the circular blisters evolve to ring-shaped buckles, whatever the smooth or undulating type of their edges. The experimental results have been compared to finite element simulations. In particular, the polygonal collapsed part at the center of the buckles can be well understood by taking into account the pressure mismatch between the inside and outside parts of the buckles.

中文翻译：

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压力引起的从波浪形圆形扣到环形扣的过渡

我们报告了通过溅射在硅片上沉积的钽膜上观察到的屈曲结构。结果表明，在临界直径以上，无论其边缘是光滑还是起伏的类型，圆形气泡都会演变成环形带扣。实验结果已与有限元模拟进行了比较。特别地，通过考虑带扣的内部和外部之间的压力失配，可以很好地理解带扣的中心处的多边形塌陷部分。