The Graphene/copper matrix (Gr/Cu) composite foils were successfully fabricated by pulse electrodeposition from copper sulfate solution containing graphene nanoplates ranging from 0.04 to 1.6g/L. The morphology, microstructure, tensile properties and nanoindentation hardness of Gr/Cu composite foils were characterized. The results indicated that the few-layer graphene nanoplates were distributed in nanotwined Cu matrix, Gr/Cu composite foils existed in the form of graphene nanoplates wrapped by Cu grains. With the increase of graphene concentration in electrolyte, the tensile strength of Gr/Cu composite foil decreased from 367 to 236 MPa, then increased up to 274 MPa. Similarly, the hardness decreased from 2.02 to 1.44 GPa, and then increased up to 1.71 GPa. Then, the crystalline size (d) calculated based on the XRD patterns changed from 520 to 890 nm and then decreased to 710 nm. The variation of tensile strength and hardness was mainly attributed to the change of the crystalline size. Besides, graphene defects of Gr/Cu composite foils were taken into account to explain the change of tensile strength and hardness. The models for tensile strength, hardness and graphene concentration were proposed to evaluate the tensile strength and hardness of Gr/Cu composite foils.

石墨烯/铜基质（Gr / Cu）复合箔是通过脉冲电沉积从含硫酸铜溶液中含石墨烯纳米板的0.04至1.6g / L范围内成功制备的。表征了Gr / Cu复合箔的形貌，微观结构，拉伸性能和纳米压痕硬度。结果表明，几层石墨烯纳米板分布在纳米孪晶的Cu基体中，Gr / Cu复合箔以包裹有Cu颗粒的石墨烯纳米板的形式存在。随着电解质中石墨烯浓度的增加，Gr / Cu复合箔的拉伸强度从367降低到236 MPa，然后增加到274 MPa。同样，硬度从2.02 GPa降低到1.44 GPa，然后增加到1.71 GPa。然后，晶体尺寸（d根据XRD图谱计算的）从520变为890 nm，然后减小到710 nm。拉伸强度和硬度的变化主要归因于晶体尺寸的变化。此外，还考虑了Gr / Cu复合箔的石墨烯缺陷，以解释拉伸强度和硬度的变化。提出了抗张强度，硬度和石墨烯浓度的模型，以评价Gr / Cu复合箔的抗张强度和硬度。