Polyamide-polyhedral oligomeric silsesquioxane (PA-POSS) nanocomposites are prepared using eco-friendly surfactant-free dimer fatty acid polyamide with different wt% of POSS by a facile solvent casting method. The prepared biopolymer nanocomposites are investigated using transmission electron microscopy, scanning electron microscopy, atomic force microscopy to understand the structural orientation between POSS and polyamide. Thermogravimetric analysis indicates that the PA-POSS have better thermal stability as compared to that of pristine polymers. Differential scanning calorimetry shows a shift in glass transition temperature as the loadings of POSS increase in the polymer. Dielectric properties such as dielectric breakdown strength, dielectric permittivity, dielectric loss, and AC conductivity are performed on polymeric materials to investigate frequency dependent dielectric properties. Results showed that the thermal stability and dielectric permittivity of PA-POSS are 25% superior compared to pristine polyamides; such an enhancement may be due to the POSS being uniformly settled in nano-level by proper structural orientation of POSS with the polyamide throughout the polymer matrix. PA-POSS nanocomposites exhibiting improved dielectric properties can be explored for the fabrication of biocompatible polymeric film capacitors application.

中文翻译：

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生物聚酰胺多面体低聚硅藻土 (PA-POSS) 纳米复合材料的增强介电和热性能


采用环保型无表面活性剂二聚脂肪酸聚酰胺和不同 wt% POSS，通过简便的溶剂浇铸法制备了聚酰胺-多面体低聚倍半硅氧烷（PA-POSS）纳米复合材料。使用透射电子显微镜、扫描电子显微镜、原子力显微镜对制备的生物聚合物纳米复合材料进行研究，以了解 POSS 和聚酰胺之间的结构取向。热重分析表明，与原始聚合物相比，PA-POSS 具有更好的热稳定性。差示扫描量热法显示，随着聚合物中 POSS 含量的增加，玻璃化转变温度发生变化。对聚合物材料进行介电击穿强度、介电常数、介电损耗和交流电导率等介电特性，以研究频​​率相关的介电特性。结果表明，PA-POSS 的热稳定性和介电常数比原始聚酰胺高出 25%；这种增强可能是由于 POSS 与聚酰胺在整个聚合物基质中的适当结构取向均匀地沉积在纳米级。 PA-POSS 纳米复合材料表现出改善的介电性能，可用于制造生物相容性聚合物薄膜电容器应用。