Thermal contact resistance between two adjacent materials is one of the major concerns in a large variety of practical situations in heat transfer. The presence of this resistance yields a temperature jump across the interface. Due to this discontinuity, numerical modelling of thermal contact resistance runs into difficulties. In this work, we propose a simple and efficient numerical model to account for thermal contact resistance at immersed interfaces in multi-material heat transfer. The present model is based on the diffuse interface method. The effect of contact resistance between two adjacent materials is accounted for in the mixing laws of the thermal conductivity and the heat capacity. The model is validated through different test cases, including both steady and unsteady conduction, and applied to simulation of chill cooling and solidification of a steel sample on board the International Space Station.

在传热的许多实际情况下，两种相邻材料之间的热接触电阻是主要关注的问题之一。该电阻的存在会在界面上产生温度跃变。由于这种不连续性，热接触电阻的数值建模变得困难。在这项工作中，我们提出了一个简单有效的数值模型来解决多材料传热中浸没界面处的热接触电阻。本模型基于扩散接口方法。两种相邻材料之间的接触电阻的影响在导热率和热容的混合定律中得到解释。该模型通过不同的测试案例进行了验证，包括稳态和非稳态传导，