That increasing temperature is beneficial for solder-wetting but not for amorphous-maintaining the state causes difficulties in joining of Zr-based bulk metallic glass (BMG). In order to solve the contradiction, this paper presents a two-step process of pre-cladding ultrasonic soldering, in which a Zn-6Al-3Cu-20Sn solder layer was firstly vacuum-cladded on surface of a Ti-6Al-4V sample, and then a Zr-14Cu-10Ti-8Ni BMG sample was ultrasonic-soldered to the solder layer without flux. Microstructures of the Zr-14Cu-10Ti-8Ni/Zn-6Al-3Cu-20Sn/Ti-6Al-4V soldering joints were studied using optical microscope, SEM, EDS, and XRD, and shear strengths were tested. Results show that shear strength ranges from 20 to 50 MPa among the joints obtained under different soldering temperatures and ultrasonic times. Shear fracture of all the experimental ultrasonic soldered joints occurred at the interface between solder and Zr-based BMG. The fracture surface shows a mixture of solder tearing and solder peeling off from the surface of the Zr-based BMG. Pits or grooves formed on surface of Zr-based BMG by ultrasonic cavitation benefit not only chemical adhesion but also mechanical adhesion by an anchoring effect. This work confirmed that ultrasonic treatment is very effective for the soldered joint of Zr-based BMG.

升高温度有利于焊料润湿，但不利于保持非晶态，这会导致Zr基块状金属玻璃（BMG）的接合变得困难。为了解决这一矛盾，本文提出了两步的超声波熔覆​​预焊接工艺，其中首先将Zn-6Al-3Cu-20Sn焊料层真空包覆在Ti-6Al-4V样品的表面，然后将Zr-14Cu-10Ti-8Ni BMG样品超声焊接至无助焊剂的焊料层。使用光学显微镜，SEM，EDS和XRD研究了Zr-14Cu-10Ti-8Ni / Zn-6Al-3Cu-20Sn / Ti-6Al-4V焊接接头的微结构，并测试了剪切强度。结果表明，在不同焊接温度和超声时间下得到的接头之间的剪切强度范围为20至50 MPa。所有实验超声焊接接头的剪切断裂都发生在焊料与Zr基BMG之间的界面处。断裂表面显示出焊料从Zr基BMG表面撕裂和剥离的混合物。通过超声空化作用在Zr基BMG表面形成的凹坑或凹槽不仅有利于化学粘合，而且还具有锚固作用，有助于机械粘合。这项工作证实了超声处理对于Zr基BMG的焊接接头非常有效。