ABSTRACT

In response to the critical needs of high power density, advanced thermal gap fillers (TGF) are required for the long-term reliability of electronics packaging. In this study, dispensable thermal gap filler (Al87GO6) with 87 wt.% Al₂O₃, 6 wt.% graphene oxide and 7 wt.% polymers were fabricated as two parts (Part A and Part B). The thermal conductivity of cured Al87GO6 (3.87 W/m.K) was 1.03, 1.11 and 1.24 times higher than commercially available thermal gap fillers TGF A, TGF B and TGF C, respectively. Part A and Part B components of Al87GO6 TGF exhibit a higher plateau value of zero shear viscosity. The lightweight graphene oxide has significantly reduced Al87GO6 TGF’s density by ~30–48%. The dielectric constant of Al87GO6 TGF was around ~6–17% lower than commercial TGF. Hence, the fabricated Al87GO6 TGF can be used as an alternative TGF for efficient heat dissipation.

摘要

为了满足高功率密度的关键需求，电子封装的长期可靠性需要先进的热间隙填充剂 (TGF)。在这项研究中，可分配的热填缝剂 (Al87GO6) 与 87 wt.% Al ₂ O ₃，6 wt.% 的氧化石墨烯和 7 wt.% 的聚合物被制造为两部分（A 部分和 B 部分）。固化后的 Al87GO6 (3.87 W/mK) 的热导率分别是市售热填缝剂 TGF A、TGF B 和 TGF C 的 1.03、1.11 和 1.24 倍。Al87GO6 TGF 的 A 部分和 B 部分组分表现出较高的零剪切粘度平台值。轻质氧化石墨烯显着降低了 Al87GO6 TGF 的密度约 30–48%。Al87GO6 TGF 的介电常数比商业 TGF 低约 6-17%。因此，制造的 Al87GO6 TGF 可用作替代 TGF 以实现有效散热。