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Analysis of reliability based on thermal cycle and aging effect in electron devices
Pramana ( IF 1.9 ) Pub Date : 2021-04-03 , DOI: 10.1007/s12043-021-02101-4
R Seetharaman , D Anitha

This paper concentrates on the estimation of reliability of an automotive electronic power device using thermal cycle, aging effect and accumulated damage. Thermal model has been developed for analysing the factors of power loss. A look-up table has been constructed to calculate the power loss and finite-element modelling was used to find out the aging effect. Thermal model was developed by using FLOTHERM. It is in the form of either Foster or Cauer network. Comparison of results from the thermal model has been done. Preprocessing of data by filtration and spectrum truncation was also explored. Reliability can also be estimated by calculating the accumulated damage with the help of Pagoda Roof method and Miner’s rule. Finally, a method was proposed of using Ga NFET instead of MOSFET to calculate power dissipation.



中文翻译:

基于电子器件的热循环和老化效应的可靠性分析

本文着重于利用热循环,老化效应和累积损伤来评估汽车电子功率器件的可靠性。已经开发出热模型来分析功率损耗的因素。已经建立了一个查找表来计算功率损耗,并使用有限元建模来找出老化效果。热模型是使用FLOTHERM开发的。它采用Foster或Cauer网络的形式。热模型结果的比较已经完成。还研究了通过过滤和光谱截断对数据进行预处理。可靠性也可以通过使用Pagoda Roof方法和Miner规则计算累积损伤来估算。最后,提出了一种用Ga NFET代替MOSFET计算功耗的方法。

更新日期:2021-04-04
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