ABSTRACT

CFRP plates are important advanced material used in the aerospace field, high-quality and high-efficiency drilling is the main application processing demand of CFRP. In this paper, a 532 nm nanosecond fiber laser with adjustable pulse duration is used and the scanning path was planned as Z-direction up-bottom incremental cutting, and X-Y direction concentric circle cutting scanning mode to realize the CFRP plates hole drilling, and obtain high drilling performance. The mechanisms of material removal for CFRP plates hole drilling under 532 nm nanosecond laser is explored, and it is mainly attributed to thermal evaporation accompanied by certain heating carbonization. The results show that a narrow width of HAZ can be obtained with short pulse duration, the minimum value of HAZ width at hole entrance edge is 18.74 µm, and the matrix material damage near the HAZ becomes small. Reducing the pulse duration also helps to decrease the drilling taper (minimum taper value 0.046), the taper of the drilling hole is smaller than that of the drilling dicing. But the drilling efficiency is reduced due to the low pulse energy with short pulse duration.

摘要

CFRP板材是航空航天领域重要的先进材料，高质量、高效率的钻孔是CFRP的主要应用加工需求。本文采用脉宽可调的532 nm纳秒光纤激光器，扫描路径规划为Z向上下增量切割，XY方向同心圆切割扫描方式，实现CFRP板材钻孔，获得高钻孔性能。探讨了532 nm纳秒激光下CFRP板孔钻孔的材料去除机理，主要归因于热蒸发伴随一定的加热碳化。结果表明，短脉冲持续时间可以获得较窄的热影响区宽度，孔入口边缘热影响区宽度最小值为18.74 μm，热影响区附近基体材料损伤变小。减少脉冲持续时间也有助于减小钻孔锥度（最小锥度值 0.046），钻孔锥度小于钻孔切割的锥度。但由于脉冲能量低，脉冲持续时间短，钻孔效率降低。