With the innovation of high power and high integration for chips in microwave devices, the research of high-efficiency integrated cooling system is advancing. Current cooling architecture has disadvantages of poor impurity tolerance, large terminal heat exchanger, and low system reliability. An integrated closed cooling system is proposed to conquer cooling problems in radio frequency microsystem. A principle prototype of the closed cooling system is established, integrated with micropump, heat exchanger, and silicon based micro-channel substrate. A heat flux of 500 W/cm² for high-power chip cooling is achieved with temperature rise less than 50 °C, which demonstrates high efficiency and reliability of present integrated closed cooling system.

随着微波器件芯片高功率，高集成度的创新，高效集成冷却系统的研究也在不断发展。当前的冷却体系结构具有杂质耐受性差，终端热交换器大和系统可靠性低的缺点。提出了一种集成的封闭式冷却系统，以解决射频微系统中的冷却问题。建立了封闭式冷却系统的原理原型，并与微型泵，热交换器和硅基微通道基板集成在一起。在温度上升低于50°C的情况下，实现了用于大功率芯片冷却的500 W / cm ^2的热通量，这证明了本集成闭式冷却系统的高效率和可靠性。