In this study, we suggest a nano-cutting system to determine the shear strength of the thin films using fracture mechanics analysis of the diamond blade. Based on Merchant's cutting model, we analyze the thin films cutting process with regard to shear angle and resistant forces as initiation of the yield in the chip to establish a direct correlation between the cutting forces and the shear strength. Validating the proposed method was conducted using homogenous polycarbonate disk showing similar shear strengths between different cutting directions. Next, we examined a thin copper electroplated film used in traces of printed circuit board. A thin copper film was examined and found the intrinsic shear strength (307.5 MPa) and adhesion force (44 N/m) between the film and substrate. The result was comparable with tensile strength values reported in the literatures. Finally, we used SEM to visually verify the feasibility of nano-cutting technique to determine thin film properties.

在这项研究中，我们建议使用纳米切割系统，通过金刚石刀片的断裂力学分析来确定薄膜的剪切强度。基于Merchant的切割模型，我们以剪切角和阻力作为切屑中屈服强度的起始点来分析薄膜的切割过程，以建立切割力与剪切强度之间的直接关系。使用均质的聚碳酸酯圆盘进行验证，该圆盘在不同的切割方向之间显示出相似的剪切强度。接下来，我们检查了用于印刷电路板痕迹的薄铜电镀膜。检查了薄铜膜，发现该膜与基材之间的固有剪切强度（307.5 MPa）和粘合力（44 N / m）。结果与文献中报道的抗张强度值相当。最后，我们使用SEM直观地验证了纳米切割技术确定薄膜特性的可行性。