As electronics get smaller and faster, novel thermal management systems are needed that are capable of dissipating higher heat fluxes. Additive manufacturing and advanced materials, such as liquid metals and synthetic ceramic, offer new opportunities to realize thermal systems. This paper investigates the use of additive manufacturing to develop thermal structures designed around liquid metals to provide active magnetohydrodynamic cooling by obviating the need for moving parts and addressing the corrosive issue of liquid metal. Optimized components for the magnetohydrodynamic cooling prototype have been conceptualized, modeled, simulated, and fabricated to enhance flow and thermal transport efficiency, magnetic flux intensity, material compatibility, and manufacturing feasibility. Prototype systems were used to determine electrical and magnetic saturation thresholds of electrodes and electromagnets under direct current and alternating current. Additionally, the effect of electroplated Hartmann wall on flow rate and pressure drop was determined. The magnetohydrodynamic cooling prototype was shown to reach volumetric flow rates of up to $650{\mathrm{mm}}^3/\mathrm{s}$ and generated pressure due to Lorentz forces of up to 230 Pa, resulting in heat transfer improvement relative to passive prototype of 1.054. Magnetohydrodynamic cooling was also compared with alternative liquid metal cooling techniques to prove its benefits.

随着电子设备变得越来越小和越来越快，需要能够消散更高热通量的新型热管理系统。增材制造和先进材料，例如液态金属和合成陶瓷，为实现热系统提供了新的机会。本文研究了利用增材制造来开发围绕液态金属设计的热结构，从而通过消除对移动部件的需求并解决液态金属的腐蚀问题来提供主动的磁流体动力冷却。磁流体动力冷却原型的优化组件已经概念化，建模，模拟和制造，以提高流动和热传输效率，磁通强度，材料兼容性和制造可行性。原型系统用于确定直流电和交流电下电极和电磁体的电和磁饱和阈值。此外，确定了电镀Hartmann壁对流速和压降的影响。磁流体动力冷却样机的容积流量最高可达到$650{\mathrm{毫米}}^3/\mathrm{s}$并由于高达230 Pa的洛伦兹力而产生压力，相对于1.054的被动原型，传热得到改善。磁流体动力冷却也与替代性液态金属冷却技术进行了比较，以证明其优势。