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Realizing forming-free characteristic by doping Ag into HfO2-based RRAM
Applied Physics Express ( IF 2.3 ) Pub Date : 2021-03-26 , DOI: 10.35848/1882-0786/abec58
Chung-Wei Wu , Chun-Chu Lin , Po-Hsun Chen , Ting-Chang Chang , Kuan-Ju Zhou , Wen-Chung Chen , Yung-Fang Tan , Yu-Hsuan Yeh , Sheng-Yao Chou , Hui-Chun Huang , Tsung-Ming Tsai , Simon M. Sze

In this work, Ag-doped HfO2-based resistive random access memory (RRAM) with high on-off ratio, low-power consumption and forming-free properties was investigated. We propose the fabrication flow of the RRAM with via-hole structure. After doping Ag into HfO2 as the switching layer, the devices could execute resistive switching without a high-voltage forming process. The conduction mechanism was subsequently validated by a current fitting analysis. Electric field simulation was also utilized to observe the electric field distribution and finally a physical model was proposed to provide an explanation for the formation and dissolution of the filament.



中文翻译:

实现通过掺杂的Ag自由成形特性为基于的HfO 2-RRAM

在这项工作中,掺杂Ag的的HfO 2为基础的高的通断比,低功率消耗和形成无属性电阻式随机存取存储器(RRAM)进行了研究。我们提出的RRAM与通孔结构的制造流程。掺杂的Ag成后的HfO 2作为切换层,该装置可在不高电压形成处理执行电阻开关。传导机制随后通过电流拟合分析验证。电场仿真还用于观察电场分布,并提出了最后一个物理模型,以提供灯丝的形成和溶解的解释。

更新日期:2021-03-26
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