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Demonstration of n-Ga2O3/p-GaN Diodes by Wet-Etching Lift-Off and Transfer-Print Technique
IEEE Electron Device Letters ( IF 4.1 ) Pub Date : 2021-02-03 , DOI: 10.1109/led.2021.3056445 Yang Liu , Lai Wang , Yuantao Zhang , Xin Dong , Xiankai Sun , Zhibiao Hao , Yi Luo , Changzheng Sun , Yanjun Han , Bing Xiong , Jian Wang , Hongtao Li
IEEE Electron Device Letters ( IF 4.1 ) Pub Date : 2021-02-03 , DOI: 10.1109/led.2021.3056445 Yang Liu , Lai Wang , Yuantao Zhang , Xin Dong , Xiankai Sun , Zhibiao Hao , Yi Luo , Changzheng Sun , Yanjun Han , Bing Xiong , Jian Wang , Hongtao Li
In this letter, a 400-nm-thick $\beta $
-Ga
2
O
3 nanomembrane is extracted from an n-Ga
2
O
3
-on-silicon wafer by wet etching, and then transferred to a p-GaN/ sapphire wafer by transfer-print technique to fabricate n-Ga
2
O
3
/p-GaN heterojunction diodes. X-ray photoelectron spectroscopy (XPS) measurement is used to accurately confirm that the valence-band offset of the heterojunction is 1.41± 0.07 eV. The diodes exhibit excellent electrical properties including high rectification ratio (
${3.85}\times {10} ^{{6}}$ at ±5 V) and low reversed current density (
${1.51}\times {10} ^{-{7}}\,\,\text{A}\cdot $
cm
−2 at −5 V). The results show that the lift-off and transfer-print processes pave a new way for fabricating high-performance Ga
2
O
3
-based heterojunctions and bipolar devices.
中文翻译:
湿蚀刻剥离和转移印刷技术论证n-Ga 2 O 3 / p-GaN二极管
在这封信中,一个400纳米的厚度 $ \ beta $
通过湿法刻蚀从硅上n-Ga 2
O
3晶片上提取
-Ga
2
O
3纳米膜
,然后通过转移印刷技术将其转移到p-GaN /蓝宝石晶片上,以制造n-Ga
2
O
3
/。 p-GaN异质结二极管。X射线光电子能谱(XPS)测量用于准确确认异质结的价带偏移为1.41±0.07 eV。二极管具有出色的电性能,包括高整流比(
$ {3.85} \ times {10} ^ {{6}} $ 在±5 V时)和低反向电流密度(
$ {1.51} \ times {10} ^ {-{7}} \,\,\ text {A} \ cdot $ -2在-5 V时为
cm
-2)。结果表明,剥离和转移印刷工艺为制造高性能
基于Ga 2
O
3的异质结和双极器件铺平了新途径
。
更新日期:2021-03-26
中文翻译:
湿蚀刻剥离和转移印刷技术论证n-Ga 2 O 3 / p-GaN二极管
在这封信中,一个400纳米的厚度