Steinberg-equation-based vibration mechanical fatigue lifetime estimation of the Sn-Ag-Cu-based solder joints was extracted for the power semiconductor modules. In this model, maximum displacement of the printed circuit board (PCB) is used as the failure root cause for mechanical lifetime estimation. Contrary to the existing lifetime models, the proposed model is capable of considering the effects of location of the power semiconductor modules in the PCB leading to much more accurate predictions. For confirmation, multiple tests are conducted to support the theoretical process for the calculation of the lifetime of the solder joint under vibration loading. Experiments are carried out on the basis of the ISO16750-3 test-I standard. The results show that the maximum error between analytical methods and experimental tests is limited to 55% for the central power semiconductors.

中文翻译：

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Steinberg模型在功率半导体中基于Sn-Ag-Cu-Cu的焊点振动寿命评估中的应用

针对功率半导体模块，提取了基于Ste-Ag-Cu-Cu焊点的基于Steinberg方程的振动机械疲劳寿命估计。在此模型中，将印刷电路板（PCB）的最大位移用作机械寿命估算的故障根本原因。与现有的寿命模型相反，所提出的模型能够考虑功率半导体模块在PCB中的位置影响，从而导致更准确的预测。为了证实这一点，进行了多次测试以支持理论过程来计算振动载荷下焊点的寿命。实验是根据ISO16750-3 test-I标准进行的。