An on-chip, low-loss, and wideband transition to dielectric slab waveguide is proposed in this article, for millimeter-wave interchip communication network applications. The transition design features a three-terminal circuit with one on-chip planar microstrip line and two off-chip dielectric slab-waveguide ports. It presents an add-drop attribute, which can be employed to realize the traditional bus and backbone network topologies. Prototypes presented operate on a thin-film layer imitating the back-end-of-line layers of a chip. Measurements are performed for an end-to-end connection and a hexagonal ring interconnect network at 170 and 100 GHz, respectively. In addition, the proposed transition is shown to enable an equal signal power distribution scheme in a linear array of receivers. To provide much needed relaxation against mechanical tolerances and thermal expansion effects in multiport circuits based on the ceramic dielectric waveguide, a novel low-loss and mechanically flexible connection between two dielectric slab waveguides is presented. The design of this connection, operating from 80 to 100 GHz, is verified by measurements. Technical merits, packaging attributes, and limitations of the proposed single hierarchy interchip interconnect network are discussed.

中文翻译：

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基于毫米波介电板的芯片到芯片互连网络，允许宽松的装配公差

本文针对毫米波芯片间通信网络应用，提出了片上低损耗宽带过渡到介质平板波导的方法。过渡设计的特点是具有一个芯片上平面微带线和两个芯片外电介质平板波导端口的三端电路。它提供了一个拖放属性，可用于实现传统的总线和骨干网络拓扑。提出的原型在模仿芯片后端层的薄膜层上运行。分别对170 GHz和100 GHz的端到端连接和六角环互连网络进行测量。另外，示出了所提出的过渡以在接收机的线性阵列中实现相等的信号功率分配方案。为了在基于陶瓷介质波导的多端口电路中提供针对机械公差和热膨胀效应的急需的松弛，提出了两个介质平板波导之间的新型低损耗和机械柔性连接。该连接的设计工作在80至100 GHz的范围内，已通过测量验证。讨论了所提出的单层级芯片间互连网络的技术优点，封装属性和局限性。