A technique for realizing an efficient broadside radiation bond-wire antenna for short-range wireless communication is demonstrated. The bond wire forming the antenna is located around 375 μm375~\mu \text{m} ( ∼λ\sim \lambda /4 at 180 GHz) above the ground plane on a printed circuit board (PCB) for constructive interference of reflected waves from the PCB and that radiated from the antenna. At 178.3 GHz, a gold bond wire shaped in a half loop and terminated on a bond pad of a neighboring chip 975- μm\mu \text{m} away exhibits a measured peak gain of 2.5 dB at the ϕ=90∘\phi = 90^{\circ } plane. The antenna also exhibits >20 GHz measured −10-dB |S11|\vert \text{S}_{11}\vert bandwidth. The simulated efficiency is 52%.

中文翻译：

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用于短距离无线通信的 180GHz 宽边辐射键合线天线


演示了一种实现短距离无线通信的高效侧面辐射键合线天线的技术。形成天线的键合线位于印刷电路板 (PCB) 上接地平面上方约 375 μm375~\mu \text{m} ( ∼λ\sim \lambda /4 at 180 GHz) 处，用于反射波的相长干扰来自 PCB 的辐射和来自天线的辐射。在 178.3 GHz 时，半环形状的金键合线终止于距离 975-μm\mu \text{m} 的相邻芯片的键合焊盘上，在 phi=90∘\phi 时测得的峰值增益为 2.5 dB = 90^{\circ } 平面。该天线还具有 >20 GHz 测量的 −10-dB |S11|\vert \text{S}_{11}\vert 带宽。模拟效率为52%。