The article presents a literature review of electromechanical impedance spectroscopy for structural health monitoring, with emphasis in adhesively bonded joints. The concept behind electromechanical impedance spectroscopy is to use variable high-frequency structural vibrations with piezoelectric elements to monitor the local area of a structure for changes in mechanical impedance that may indicate imminent damage. Various mathematical models that correlate the structural impedance with the electric response of the piezoelectric sensors are presented. Several algorithms and metrics are introduced to detect, localize, and characterize damage when using electromechanical impedance spectroscopy. Applications of electromechanical impedance spectroscopy to study adhesive joints are described. Research and development of alternative hardware for electromechanical impedance spectroscopy is presented. The article ends by presenting future prospects and research of electromechanical impedance spectroscopy–based structural health monitoring, and, while advances have been made in algorithms for damage detection, localization, and characterization, this technology is not mature enough for real-world applications.

本文介绍了用于结构健康监测的机电阻抗谱的文献综述，重点是粘接接头。机电阻抗谱的概念是使用带有压电元件的可变高频结构振动来监视结构的局部区域的机械阻抗变化，这可能表示即将发生的损坏。提出了将结构阻抗与压电传感器的电响应相关的各种数学模型。引入了几种算法和度量标准，以在使用机电阻抗谱时检测，定位和表征损坏。描述了机电阻抗谱在研究粘合接头中的应用。介绍了用于机电阻抗谱的替代硬件的研究与开发。本文最后介绍了基于机电阻抗谱的结构健康监测的未来前景和研究，尽管在损伤检测，定位和表征的算法方面取得了进步，但该技术对于实际应用还不够成熟。