In a traditional thermoelectric π-type module, there is severe thermal stress at the hot side due to the thermal expansion of the hot-side ceramic plate and the mismatch between the coefficient of thermal expansion values among the different components, resulting in the likely development of permeant strain in the module, which leads to short lifetime. In this study, a new module design is proposed to reduce the thermal stress and enhance the lifespan of the module by 68%. Simulation using COMSOL 5.4 Multiphysics software confirmed the advantage. For a given module size, the new design has also a positive effect on the output performance of the thermoelectric module. Such an improvement may be implemented in future module manufacturing for improved performance.

在传统的热电π型模块中，由于热侧陶瓷板的热膨胀以及不同组件之间的热膨胀系数值之间的不匹配，热侧会产生严重的热应力，从而有可能发展组件中的渗透应变会缩短使用寿命。在这项研究中，提出了一种新的模块设计，以减少热应力并将模块的使用寿命延长68％。使用COMSOL 5.4 Multiphysics软件进行的仿真证实了这一优势。对于给定的模块尺寸，新设计还对热电模块的输出性能产生积极影响。可以在将来的模块制造中实现这种改进，以提高性能。