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Theoretical Analysis of Plasma Parameters on Film Deposition in planer and Cylindrical Magnetron Sputtering
Indian Journal of Pure & Applied Physics ( IF 0.6 ) Pub Date : 2021-03-16
Gaurav Gupta, R K Tyagi

Thin film deposition using plasma sputter is done by experimental methods, though Numerical simulation and theory are capable of generating realistic and useful results. In present exploration a theoretical model for sputtering with consequence of different plasma parameters with the help of electromagnetic lenses for planar (Tp) and cylindrical (Tc) magnetron sputteringhas been conversed. The plasma of helium gas on nickel metal objectwhich contains the velocity shear instability is considered, and Tp,Tc, under the influence of shear scale length(Ai), homogeneous DC electric field(E0), magnetic field (B0), density gradient (ɛnρi) have been evaluated. Tp, and Tcare found to be maximum in the range of 0.815–0.91, and 0.57–0.90, respectively. Also growth rate showed direct relation to E0 and Ai but inversely varies with B0 and ɛnρi.

中文翻译:

平面和圆柱磁控溅射膜沉积等离子体参数的理论分析。

使用等离子体溅射的薄膜沉积是通过实验方法完成的,尽管数值模拟和理论能够产生现实和有用的结果。在目前的探索中,已经针对用于平面(T p)和圆柱形(T c)磁控溅射的电磁透镜,对由于等离子体参数不同而进行溅射的理论模型进行了研究。考虑了包含速度剪切不稳定性的镍金属物体上的氦气等离子体,并在剪切标度长度(A i),均匀直流电场(E 0),磁场(B 0)的影响下,T pT c),密度梯度(ɛ Ñ ρ)进行了评价。 发现T pT c分别在0.815–0.91和0.57–0.90的范围内最大。也增长率表明直接关系到E 0和A但反比乙变化0和ɛ Ñ ρ
更新日期:2021-03-16
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