In this study, assemblies comprising poly(methyl methacrylate) (PMMA) bonded to glass were subjected to a temperature gradient from +30 °C to −40 °C at 0% humidity. Their behaviour was recorded using a 3D digital image correlation (DIC) setup. The deformations and the thermally induced surface strain development, due to thermal loading, were recorded using a stereo camera system with two charge-coupled device (CCD) cameras. Narrow field measurements were performed near the edges of the joint where a high concentration of peeling and shear strains might be expected. With the use of commercial DIC software, the thermal deformation of the structure and the developed surface strain fields (ε_xx, γ_xy, ε_yy) are analysed. Joints with different bond line thickness (0.5 mm, 2 mm, 3.2 mm) of the silicone adhesive were investigated. The continuous image capture with the CCD cameras allowed identification of the failure conditions and the exact moment of failure of the bonded assembly. Additionally, the DIC experiment results were evaluated with the help of finite-element analysis results, which are in excellent agreement. This showed that the DIC method can be successfully applied for the investigation of thermally induced strains in adhesively bonded assemblies and thus contribute to understanding of the underlying thermal/mechanical behaviour of bonded systems.

在这项研究中，将包含粘合到玻璃上的聚（甲基丙烯酸甲酯）（PMMA）的组件在0％湿度下置于+30°C至-40°C的温度梯度下。使用3D数字图像关联（DIC）设置记录了他们的行为。使用带有两个电荷耦合器件（CCD）摄像机的立体声摄像机系统记录由于热负荷引起的变形和由热引起的表面应变的发展。在关节边缘附近进行窄场测量，可能会出现高浓度的剥离和剪切应变。通过使用商用DIC软件，可以对结构进行热变形并开发出表面应变场（_εxx，_γxy，_εyy）进行分析。研究了具有不同粘合线厚度（0.5 mm，2 mm，3.2 mm）的有机硅粘合剂的接缝。用CCD摄像机连续拍摄图像，可以识别粘合组件的失效状况和确切的失效时刻。此外，借助有限元分析结果对DIC实验结果进行了评估，这非常吻合。这表明，DIC方法可以成功地用于研究粘合组件中的热致应变，从而有助于理解粘合系统的基本热/机械性能。