In this work, a new heat dissipation method based on ultra-thin flattened heat pipe (UTHP) is developed for cooling watch-phones. The UTHP with a 0.4 mm thickness was designed to be a three-dimensional shape according to the watchcase shape. The UTHP cooling module (HPM) was soldered by three copper plates and a UTHP. The heat dissipation performance of the copper sheet cooling module (CSM) with the same dimensions was made for comparison with the HPM. The heat dissipation performance of the HPM was experimentally studied. The results indicate that the maximum heat dissipation powers of CSM and HPM were 0.8 and 0.9 W, respectively, at the surface temperature of the ceramic heater not exceeding 65 °C. At this time, ΔT_c and R_hc of them were 9.18 °C and 9.86 °C/W, 3.98 °C and 2.63 °C/W, respectively. When the cooling module was cooled naturally from 65 to 37 °C, the heat dissipation time of HPM was 25 s shorter than that of CSM. The UTHP cooling module has a better heat dissipation performance, which can quickly reduce the chip temperature, eliminate the chip hotspot, and solve the heat dissipation issue of watch-phone.

在这项工作中，开发了一种基于超薄扁平热管（UTHP）的散热方法，用于冷却手表电话。根据表壳的形状，将厚度为0.4mm的UTHP设计为三维形状。UTHP冷却模块（HPM）由三个铜板和一个UTHP焊接。为了与HPM进行比较，制作了具有相同尺寸的铜片冷却模块（CSM）的散热性能。对HPM的散热性能进行了实验研究。结果表明，在陶瓷加热器的表面温度不超过65°C时，CSM和HPM的最大散热功率分别为0.8 W和0.9W。此时，ΔT _c和R _hc其中分别为9.18°C和9.86°C / W，3.98°C和2.63°C / W。当冷却模块从65自然冷却到37°C时，HPM的散热时间比CSM短25 s。UTHP散热模块具有更好的散热性能，可以快速降低芯片温度，消除芯片热点，解决了手机的散热问题。