The submitted paper is mainly concerned with the cracking of blind and buried vias of printed circuit board (PCB) for smartphones which were encountered with abnormal display problems like scramble display or no display during service and had to be recalled.,To found out the root causes of this failure and dissolve this commercial dispute, comprehensive failure analysis was performed on the printed circuit board assemblies (PCBAs) and PCBs of the failed smartphone, such as macrograph and micrograph observation, chemical compositions analysis, thermal performance testing and blind via pull-off experiment, which finally helped to determine the causes. Besides that, the failure mechanisms were discussed in detail, and pertinent countermeasures were proposed point by point.,It was found that the PCB blind vias cracking was the main reason for the scramble display or no display of the smartphone, and the incomplete cleaning process before copper plating was the root cause of the blind vias cracking.,Achievement of this paper would not only help to provide the solid evidence for determining the responsibility of this commercial dispute but also lead to a better understanding of the failure mechanisms and prevention methods for similar failure cases of other advanced mobile phones.,Most failure analysis researches of PCBAs only focused on the unqualified products from manufacturing, while this paper addressed a failure analysis case of PCBAs products for smartphones from actual services, which was relatively rarely reported in the past.

中文翻译：

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高端手机印刷电路板盲埋孔开裂失效分析

提交的论文主要涉及智能手机PCB盲埋孔开裂，在使用过程中出现乱屏、无显示等异常显示问题，不得不召回。,寻根问底。 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .针对此次故障的原因，化解了此次商事纠纷，对故障智能手机的PCBA和PCB进行了宏观和显微观察、化学成分分析、热性能测试、盲孔等综合故障分析。关闭实验，这最终有助于确定原因。除此之外，还详细讨论了故障机制，并提出了针对性的对策。