The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually required by the sensing film to detect different gases which imply the requirement of thermally stable interconnects. To observe the effect of parameters influencing power of the device, electro-thermal simulation of LTCC hotplate is also presented. Simulated LTCC hotplate is fabricated using the LTCC technology.,The proposed task is to fabricate LTCC hotplate with interconnects through vertical access. Dedicated via-holes generated on the LTCC hotplate are used to provide the interconnections. These interconnections are based on adherence and bonding mechanism between LTCC and thick film. COMSOL software is used for finite element method (FEM) simulation of the LTCC hotplate structure.,Thermal reliability of these interconnections is tested by continuous operation of hotplate at 350°C for 175 h and cycling durability test performed at 500°C. Additionally, vibration test is also carried out for the hotplate with no damage observed in the interconnections. An optimized firing profile to reproduce these interconnections along with the experimental flowchart is presented.,Research activity includes design and fabrication of LTCC hotplate with metal to thick-film based interconnections through vertical access. Research work on interconnections based on adherence of LTCC and thick film is limited.,A new way of providing lead-free and reliable interconnections will be useful for gas sensor fabricated on LTCC substrate. The FEM results are useful for optimizing the design for developing low-power LTCC hotplate.,Adherence and bonding mechanism between LTCC and thick film can be used to provide interconnections for LTCC devices. Methodology for providing such interconnections is discussed.

中文翻译：

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具有无铅互连的 LTCC 电热板的电热模拟和制造

本文的目的是探索一种新的可能性，为低温共烧陶瓷（LTCC）电炉提供高温稳定的无铅互连。对于气体传感应用，传感膜通常需要 200°C-400°C 的温度范围来检测不同的气体，这意味着需要热稳定互连。为了观察影响器件功率的参数的影响，还介绍了 LTCC 电热板的电热模拟。模拟 LTCC 电炉是使用 LTCC 技术制造的。建议的任务是通过垂直通路制造具有互连的 LTCC 电炉。在 LTCC 加热板上生成的专用通孔用于提供互连。这些互连基于 LTCC 和厚膜之间的粘附和粘合机制。COMSOL 软件用于对 LTCC 热板结构进行有限元法 (FEM) 仿真。通过热板在 350°C 下连续运行 175 小时和在 500°C 下进行循环耐久性测试来测试这些互连的热可靠性。此外，还对加热板进行了振动测试，在互连处未观察到损坏。展示了用于重现这些互连的优化烧制曲线以及实验流程图。研究活动包括设计和制造 LTCC 加热板，通过垂直通路实现金属到厚膜互连。基于 LTCC 和厚膜粘附的互连的研究工作有限。提供无铅和可靠互连的新方法将对在 LTCC 基板上制造的气体传感器有用。FEM 结果有助于优化开发低功率 LTCC 热板的设计。LTCC 和厚膜之间的粘附和粘合机制可用于为 LTCC 器件提供互连。讨论了提供这种互连的方法。