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Transient liquid phase bonding in the Cu-Sn system
Soldering & Surface Mount Technology ( IF 1.7 ) Pub Date : 2019-09-02 , DOI: 10.1108/ssmt-09-2018-0031
Behnam Hosseinzaei , Ali Reza Kiani Rashid

This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between phases in bonding region identified through metallography pictures and applying hardness and shear strength tests.,The bonding process was carried out at a temperature of 300°C for time durations ranging from 15 to 120 min. The scanning electron microscopy equipped with energy dispersive spectroscopy system and optical microscopy were used to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine.,The intermetallic compounds of the Cu6Sn5 −η and the Cu3Sn-e were formed simultaneously in the bonding interface. Although the η-phase, which exhibits scallop-shaped morphology, grows very quickly, upon completion of the isothermal solidification stage, it turns into the e-phase. The hardness of the bonding interface is significantly higher than that of the substrate. The shear results show that once the bonding process is complete, brittle fracture occurs. Moreover, a greater decrease in strength was observed when the e-phase is the only phase in the bonding region.,The hardness number of the η-phase is higher than that of the e-phase. The hardness numbers of the η-phase and the e-phase are 894 and 689 HV, respectively. The mean shear strength values of the samples that were bonded at 300 °C for 15, 60 and 120 min were 11.7, 9.5 and 5.4 MPa, respectively.

中文翻译:

Cu-Sn系统中的瞬态液相键合

本文旨在研究瞬态液相法制备的接头的显微组织特征和力学性能。通过金相图片和应用硬度和剪切强度测试确定结合区域中相之间的差异。结合过程在 300°C 的温度下进行,持续时间为 15 到 120 分钟。配备能量色散光谱系统的扫描电子显微镜和光学显微镜用于检查显微结构特征,并通过应用显微硬度和剪切试验研究接头的机械性能。剪切试验由安装在拉伸机上的剪切夹具进行。Cu6Sn5 -n 和 Cu3Sn-e 的金属间化合物同时在键合界面形成。尽管呈现扇贝形形态的 η 相生长非常快,但在等温凝固阶段完成后,它变成了 e 相。结合界面的硬度明显高于基体的硬度。剪切结果表明,一旦结合过程完成,就会发生脆性断裂。此外,当 e 相是结合区中的唯一相时,观察到强度下降更大。η 相的硬度值高于 e 相的硬度值。η 相和 e 相的硬度值分别为 894 和 689 HV。在 300 °C 下粘合 15、60 和 120 分钟的样品的平均剪切强度值为 11.7、9.5 和 5.4 MPa,
更新日期:2019-09-02
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