The purpose of this paper is to study the mechanism of electrochemical dissolution of SAC305 solder in mild acid solution.,Cyclic voltammetry (CV) was used to obtain electrochemical dissolution peaks followed by chronoamperometery (CA) to investigate the dissolution mechanism at each peak. Structural and microstructural characterization was performed to verify the CA analysis. Potentiodynamic polarization was performed afterwards to determine the corrosion potential of every phase in SAC305.,The early cycle of CV exhibits only dissolution peaks of β-Sn until intermetallic compound (IMC) peaks emerged at a later cycle. CA performed for 24 h at selected potentials reveals that β-Sn can be removed completely from the sample without disrupting the IMC network at a suitable potential. This was later verified by XRD and SEM. Potentiodynamic polarization determined the corrosion potential of IMC as −0.36 V.,The mechanism of anodic dissolution of SAC305 was studied and proposed.

中文翻译：

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Sn-3Ag-0.5Cu焊料合金中金属间化合物阳极溶解行为的循环伏安法研究

本文的目的是研究SAC305焊料在弱酸溶液中的电化学溶解机理。利用循环伏安法（CV）获得电化学溶解峰，然后用计时电流法（CA）研究每个峰的溶解机理。进行结构和微观结构表征以验证 CA 分析。之后进行动电位极化以确定 SAC305 中各相的腐蚀电位。CV 的早期循环仅显示 β-Sn 的溶解峰，直到金属间化合物 (IMC) 峰出现在后期循环。在选定电位下进行 24 小时的 CA 表明，β-Sn 可以从样品中完全去除，而不会在合适的电位下破坏 IMC 网络。这后来被 XRD 和 SEM 证实。