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Enhanced conduction and pool boiling heat transfer on single-layer graphene coated substrates
Journal of Enhanced Heat Transfer ( IF 1.5 ) Pub Date : 2019-01-01 , DOI: 10.1615/jenhheattransf.2018028488
Ricardo Diaz , Zhixiong Guo

Molecular dynamics simulations were employed to understand the improved thermal conductivity and water boiling heat transfer characteristics of adding single-layer graphene (SLG) to substrates. The 100, 110, and 111 planes of Cu, Ni, Pt, and Si were selected for study based on common heat transfer and graphene-compatible materials. Vibrational density of states data was analyzed in order to view heat flux trends. After equilibration at 300K the temperature was increased to 400K for 3 ns to induce nucleate boiling (~27K wall superheat). It was found that the addition of SLG greatly improved the overall thermal conductivity of the composite substrate, with increases in the 1-2 orders of magnitude range. The temperature gradients for SLG-coated substrates were found to be much lower than bare substrates. Nanoscale boiling curves were produced. The CuG100 case shows a 14% increase in critical heat flux (CHF) (~0.36 GW/m2) over the Cu100 case, and the PtG100 shows a 9% increase (~0.48 GW/m2) over the Pt100 case. The SLG-coated substrates also required less superheat to achieve the CHF condition.

中文翻译:

单层石墨烯涂层基板上增强的传导和池沸腾传热

采用分子动力学模拟来了解向基板添加单层石墨烯 (SLG) 后的热导率和水沸腾传热特性的改善。基于常见的传热和石墨烯兼容材料,选择了 Cu、Ni、Pt 和 Si 的 100、110 和 111 平面进行研究。分析状态数据的振动密度以查看热通量趋势。在 300K 平衡后,温度升至 400K 持续 3 ns 以诱导核沸腾(~27K 壁过热)。发现SLG的加入大大提高了复合基板的整体热导率,提高了1-2个数量级。发现 SLG 涂层基板的温度梯度远低于裸基板。产生纳米级沸腾曲线。CuG100 情况的临界热通量 (CHF) 比 Cu100 情况增加 14%(~0.36 GW/m2),PtG100 比 Pt100 情况增加 9%(~0.48 GW/m2)。SLG 涂层基材也需要较少的过热来达到 CHF 条件。
更新日期:2019-01-01
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