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C-Band Hybrid 3-D-Printed Microwave Isolator
IEEE Transactions on Microwave Theory and Techniques ( IF 4.1 ) Pub Date : 2021-02-02 , DOI: 10.1109/tmtt.2021.3053277
V. Laur , J. P. Gouavogui , B. Balde

This article presents the design and fabrication of a microstrip $C$ -band microwave isolator using additive technology. Such fabrication requires multimaterial 3-D printing (dielectric and absorber) and the embedding of ferrite ceramic inside the substrate. First, our design demonstrated that an efficient microstrip load can be made by 3-D printing in a single process: not only the dielectric but also the absorber, which takes the form of steps in the substrate. Then, a circulator with a composite dielectric/ferrite resonator was designed. Finally, circulator and load were integrated in a single component to optimize the isolator. The device was then 3-D-printed with a pause during the fabrication to allow the ferrite disk to be embedded. Microwave measurements demonstrated that minimum insertion losses of 0.76 dB were achieved, together with a −15 dB bandwidth of 11.9%. To our knowledge, this is the first demonstration of the feasibility of fabricating a non-reciprocal microwave component by additive technology.

中文翻译:

C带混合3D打印微波隔离器

本文介绍了微带的设计和制造 $ C $ 带附加技术的宽带微波隔离器。这种制造需要多材料3D打印(电介质和吸收体),以及将铁氧体陶瓷嵌入基板内部。首先,我们的设计表明,可以在一个过程中通过3-D打印来实现有效的微带负载:不仅是电介质,而且是吸收体,它在基板中呈阶梯状。然后,设计了具有复合介电/铁氧体谐振器的环行器。最后,将循环器和负载集成在单个组件中,以优化隔离器。然后在制造过程中以暂停方式对该设备进行3D打印,以嵌入铁氧体磁盘。微波测量表明,最小插入损耗为0.76 dB,−15 dB带宽为11.9%。据我们所知,
更新日期:2021-03-05
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