A novel approach to copper-nickel bonding was investigated by hybrid transient liquid phase sintering (TLPS) method. Hybrid bonding material containing copper, nickel, and Sn-3.0Ag-0.5Cu (SAC305) and an organic solvent was fabricated to form a fast and stable ternary CuNiSn intermetallic compound (IMC) joint between Cu to Ni joint. The atomic distribution was analyzed by an electron probe micro-analyzer, showing full IMC formation of the hybrid TLPS joint. In addition, by simultaneously adding Cu and Ni to SAC305, the IMC was stably formed, and the bonding strength of hybrid TLPS joint was the highest.

中文翻译：

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Sn-3.0Ag-0.5Cu焊料的混合瞬态液相烧结结合Cu和Ni的Cu Ni结合

通过混合瞬态液相烧结（TLPS）方法研究了一种新的铜镍键合方法。制造包含铜，镍和Sn-3.0Ag-0.5Cu（SAC305）和有机溶剂的混合粘结材料，以在Cu与Ni接头之间形成快速稳定的三元Cu Ni Sn金属间化合物（IMC）接头。通过电子探针微分析仪分析原子分布，显示出杂化TLPS接头的完整IMC形成。另外，通过将铜和镍同时添加到SAC305中，可以稳定地形成IMC，并且混合TLPS接头的结合强度最高。