With the miniaturization and integration of electronic devices, the heat dissipation problems caused by higher power density are getting more serious, limiting the development of integrated circuits industry. Graphene, as a representative of two-dimensional materials, has attracted extensive attention for its excellent thermal properties. Ever since it has been discovered, researches have been carried out and achievements have been made both theoretically and practically. Here, we review the established theories and simulation system for 2D heat conduction, different measurement methods for thermal conductivity and graphene’s device applications. We propose two gaps between different scales and between theoretical prediction and practical effect. Owing to the higher heat dissipation requirements and the endless pursuit of better thermal performance, it is challenging but critical to continue studying and further understand the thermal properties of graphene. Challenges and opportunities are both emphasized. It is hoped that the diversification and progress in morphology and manufacturing technology can bring new development and that graphene can eventually be widely used and make huge changes to micoelectronic industry.

随着电子设备的小型化和集成化，功率密度较高引起的散热问题越来越严重，制约了集成电路产业的发展。作为二维材料的代表，石墨烯因其优异的热性能而受到广泛关注。自发现以来，已经进行了研究并在理论上和实践上都取得了成就。在这里，我们回顾了已建立的用于二维热传导的理论和仿真系统，用于热导率的不同测量方法以及石墨烯的器件应用。我们提出了不同规模之间以及理论预测与实际效果之间的两个差距。由于更高的散热要求以及对更好的热性能的不懈追求，继续研究并进一步了解石墨烯的热性能具有挑战性，但至关重要。挑战与机遇并重。希望形态和制造技术的多样化和进步能够带来新的发展，并且石墨烯最终能够被广泛使用并对微电子工业做出巨大的改变。