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White Light-Emitting Diodes With Visible Uniform Spectral Power Distribution Packaged With Phosphor-in-Silicone/Phosphor-in-Glass Stacked Structure
IEEE Journal of the Electron Devices Society ( IF 2.3 ) Pub Date : 2021-02-15 , DOI: 10.1109/jeds.2021.3059339
Liyu Huang , Zhenjin Wang , Chunliang Lin

White light-emitting diodes (WLEDs) with a visible uniform spectral power distribution (SPD) were fabricated by integrating a blue LED chip and a phosphor-in-silicone (PiS)/phosphor-in-glass (PiG) stacked package. After adjusting the doping concentrations of phosphors (cyan, green and red) in the silicone encapsulant, the PiS was dispensed in the cavity of lead frame already bonded with a blue LED chip. Then the top surface of the PiS was covered with a PiG sheet. WLEDs with the PiS/PiG stacked package achieve a warm correlated color temperature (CCT) 4200K and a high color rendering index (CRI; Ra = 90.9, R9 = 73.0, and R15 = 85.9) at 350 mA. The full-spectrum index (FSI) of WLEDs with the PiS/PiG stacked packages is 4.24 in the wavelength range of 380 nm to 730 nm, respectively. Warm WLEDs with a visible uniform SPD and a high light quality can be fabricated through the PiS/PiG stacked package.

中文翻译:

硅磷光体/玻璃磷光体堆叠结构封装的可见光光谱分布均匀的白色发光二极管

通过集成蓝色LED芯片和硅磷光体(PiS)/玻璃磷光体(PiG)堆叠封装,制造了具有可见均匀光谱功率分布(SPD)的白光发光二极管(WLED)。调整硅酮密封胶中磷光体(青色,绿色和红色)的掺杂浓度后,将PiS分配到已经与蓝色LED芯片粘结的引线框架的空腔中。然后,PiS的顶部表面覆盖有PiG薄板。具有PiS / PiG堆叠封装的WLED在350 mA时可实现暖色相关色温(CCT)4200K和高显色指数(CRI; Ra = 90.9,R9 = 73.0,R15 = 85.9)。具有PiS / PiG堆叠封装的WLED的全光谱指数(FSI)在380 nm至730 nm的波长范围内分别为4.24。
更新日期:2021-03-02
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