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A mutual inductance sensor for cryogenic radial displacement measurement
Cryogenics ( IF 1.8 ) Pub Date : 2021-03-02 , DOI: 10.1016/j.cryogenics.2021.103263
Xiang Guan , Yincai Zou , Jin Shang , Xing Bian , Jihao Wu , Qing Li

In this paper, a type of mutual inductance sensor based on the PCB technology is proposed for cryogenic radial displacement measurement. Firstly, the feasibility of the scheme is analyzed from the aspects of the low temperature usability of materials and components, and the temperature sensitivity of the sensor. Then the experiments at low temperature (77 K) and room temperature are carried out with a simple and effective setup. The experimental results show that the sensitivity has no obvious change from room temperature to low temperature, and the linearity remains at a good level. However, the standard deviation and repeatability of the measurement are affected by external factors. Generally speaking, this paper verifies the feasibility of applying this sensor to micro displacement measurement at low temperature, which lays a foundation for the development of more mature displacement sensor for HTS bearing.



中文翻译:

用于低温径向位移测量的互感传感器

本文提出了一种基于PCB技术的互感传感器,用于低温径向位移测量。首先,从材料和组件的低温可用性以及传感器的温度敏感性等方面分析了该方案的可行性。然后,通过简单有效的设置在低温(77 K)和室温下进行实验。实验结果表明,从室温到低温,灵敏度没有明显变化,线性度保持在良好的水平。但是,测量的标准偏差和可重复性受外部因素影响。一般而言,本文验证了将该传感器应用于低温微位移测量的可行性,

更新日期:2021-03-07
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