In the present work, an Al-Cu-Si-Ni-Mg brazing filler metal was developed for the joining of 6063 aluminum alloy and graphite metallized with Ag-Cu-Ti paste. The joint microstructures were studied by means of SEM and EDS. Results show that joints with a good quality can be produced at a brazing temperature of 550 °C for 10 min. TiC was formed at the graphite/active Ag-Cu-Ti paste interface due to the reaction between Ti and C, and thus, the wettability on the graphite was improved. Compared to the metallization stage, more diffusions of Al, Ag, Ti, and Cu from interlayer to graphite are observed. The bonding area mainly consists of α-Al, Ag rich phase, α + Al₂Cu + Si, Al₂Cu, and TiC. It is shown that joints with good quality can be produced and the average shear strength of the joints is 21 MPa.

在目前的工作中，开发了一种Al-Cu-Si-Ni-Mg钎料，用于连接6063铝合金和用Ag-Cu-Ti糊剂金属化的石墨。通过SEM和EDS对接头的微观结构进行了研究。结果表明，在550°C的钎焊温度下10分钟可以生产出高质量的接头。由于Ti和C之间的反应，在石墨/活性Ag-Cu-Ti糊剂界面处形成了TiC，因此提高了在石墨上的润湿性。与金属化阶段相比，观察到了Al，Ag，Ti和Cu从中间层到石墨的更多扩散。结合区域主要由α-Al，富Ag相，α+ Al ₂ Cu + Si，Al _2组成铜和TiC。结果表明，可以生产出质量优良的接头，接头的平均剪切强度为21 MPa。