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Water-repellency and surface roughness with the structures of double layers using electroplated nickel deposit from a chloride bath
Transactions of the IMF ( IF 1.2 ) Pub Date : 2021-03-01 , DOI: 10.1080/00202967.2021.1861851
S. Tako 1, 2, 3 , T. Mochizuki 4 , M. Nakayama 5 , Y. Kotsuchibashi 6 , K. Tashiro 3, 7
Affiliation  

ABSTRACT

The authors have studied water-repellency technology using a roughness structure fabricated by electroplating. This paper examined the relationship between surface morphology and water-repellency of two-layered nickel structures obtained by changing the electroplating parameters using a simple nickel chloride-based electroplating bath. As a result, it was confirmed that the surface morphology of the deposit could be transformed by electroplating the second layer at a bath temperature different from that of the first layer. The contact angle in two-layered roughness plating also tended to be higher under conditions of greater Sdq value (root mean square slope). In particular, both the Sdq value and contact angle were high for the second-layer deposited at a bath temperature of 80°C and applied electrical-quantity of 1500 C dm−2 or more. In this study, a relatively high relationship between Sdq value and contact angle was observed, and it was found that changing each layer’s electroplating conditions can control the water-repellency.



中文翻译:

氯化物浴中电镀镍沉积层的双层结构的疏水性和表面粗糙度

摘要

作者研究了使用通过电镀制造的粗糙结构的疏水技术。本文研究了通过使用简单的基于氯化镍的电镀液改变电镀参数而获得的两层镍结构的表面形态与疏水性之间的关系。结果,证实了可以通过在与第一层不同的浴温下电镀第二层来改变沉积物的表面形态。在更大的Sdq值(均方根斜率)的条件下,两层粗糙镀层的接触角也倾向于更高。尤其是,在80°C的浴温和1500 C dm的施加的电数量下沉积的第二层的Sdq值和接触角均很高。−2或更大。在该研究中,观察到Sdq值和接触角之间的相对较高的关系,并且发现改变每层的电镀条件可以控制疏水性。

更新日期:2021-03-01
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