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Characterization of AlN and AlScN film ICP etching for micro/nano fabrication
Microelectronic Engineering ( IF 2.6 ) Pub Date : 2021-02-27 , DOI: 10.1016/j.mee.2021.111530
Zhifang Luo , Shuai Shao , Tao Wu

We investigate the inductively coupled plasma (ICP) etching characteristics of (0002) Aluminum Nitride (AlN) and Aluminum Scandium Nitride (Al0.94Sc0.06N) piezoelectric thin films as well as the implementation on piezoelectric lamb wave resonators. A profile of 84° is obtained on AlN thin film, with an etching rate of approximately 230 nm/min, and a selectivity of 0.77:1 relative to photoresist mask. A nearly 80° profile and over 30:1 selectivity are accomplished using Ni film as the etching mask. Al0.94Sc0.06N film has achieved a profile of 77° by optimizing the RF power. Finally, AlN contour mode resonators (CMRs) are fabricated and characterized, and a CMR operating at about 400 MHz with a quality factor exceeding 1600 has been demonstrated.



中文翻译:

用于微/纳米制造的AlN和AlScN薄膜ICP蚀刻的表征

我们研究(0002)氮化铝(AlN)和氮化铝Aluminum(Al 0.94 Sc 0.06 N)压电薄膜的电感耦合等离子体(ICP)蚀刻特性,以及在压电Lamb波谐振器上的实现。在AlN薄膜上获得84°的轮廓,相对于光刻胶掩模,蚀刻速率约为230 nm / min,选择性为0.77:1。使用镍膜作为蚀刻掩模,可以实现接近80°的轮廓和超过30:1的选择性。铝0.94 Sc 0.06通过优化RF功率,N膜已达到77°的轮廓。最终,制造并表征了AlN轮廓模式谐振器(CMR),并证明了工作在约400 MHz且品质因数超过1600的CMR。

更新日期:2021-02-27
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