Abstract

A generalized electromagnetothermoelastic model with plasma wave is studied for a thin circular semiconducting medium which is subject to a time-dependent exponential order mechanical and thermal load at its boundary surfaces. The closed-form solution is obtained for the physical parameters by using the eigenvalue approach. The effects of thermoelastic and thermochemical coupling parameters under the different physical field components are analyzed. Results are represented graphically under the variation of different parameters.

中文翻译：

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圆形薄半导体介质的电磁热弹性分析

摘要

针对薄的圆形半导体介质，研究了具有等离子波的广义电磁热弹性模型，该介质在其边界表面受到时间依赖的指数级机械和热负荷。通过使用特征值方法获得物理参数的闭式解。分析了不同物理场分量下热弹性和热化学耦合参数的影响。结果在不同参数的变化下以图形方式表示。