A flip-chip bonding system has a high demand for both force sensing and control functions to ensure the high-quality chip interconnection. The motivation of this article is to combine the ability to enable a common flip-chip bonding system to run in the manner of active soft-landing (ASL) interconnection. The developed flexure bonder achieves these functions by designing a flexure force sensing and control mechanism integrated with strain gauge sensing and piezoelectric actuating functions. First, the design, modeling, and optimization of the flexure mechanism are presented. Theoretical analyses, including force sensing and control working principle demonstration, force–strain model derivation, and dynamics response modeling, are carried out. Besides, aiming at highly sensitive force control under high-dynamic working condition, the mechanism is optimized by the multiobjective genetic optimization algorithm. Then, this flexure bonder mechanism is analyzed and evaluated by finite-element analysis. Finally, a series of validation experiments, including force sensing calibration and performance tests, open- and closed-loop force controlling tests, ASL tests, and actual bonding tests, are successfully implemented. The results indicate that the operation accuracy of the developed system is improved up to $\pm$ 1 N under 400-N range, and the overshoot of ASL is less than 2 N under 6000-N/s loading speed. All the results uniformly confirm that the proposed bonding system can achieve precise force control and satisfactory chip interconnection performance with the proposed ASL bonding strategy.

中文翻译：

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专用于倒装芯片有源软着陆互连的单片式力敏集成挠性粘接机

倒装芯片键合系统对力感测和控制功能都有很高的要求，以确保高质量的芯片互连。本文的目的是结合使通用倒装芯片键合系统能够以主动软着陆（ASL）互连的方式运行的能力。通过设计与应变片传感和压电致动功能集成在一起的挠曲力传感和控制机构，开发出的挠曲粘合机可以实现这些功能。首先，介绍了挠曲机构的设计，建模和优化。进行了理论分析，包括力传感和控制工作原理论证，力-应变模型推导和动力学响应建模。此外，针对高动态工作条件下的高灵敏力控制，通过多目标遗传优化算法对该机制进行了优化。然后，通过有限元分析来分析和评估这种挠曲键合机构。最后，成功进行了一系列验证实验，包括力传感校准和性能测试，开环和闭环力控制测试，ASL测试以及实际粘结测试。结果表明，所开发系统的运行精度可提高到$ \ pm $ 在400-N范围内为1 N，而在6000-N / s的加载速度下ASL的过冲小于2N。所有结果均一致地证实，所提出的键合系统可以利用所提出的ASL键合策略实现精确的力控制和令人满意的芯片互连性能。