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TechRxiv: Share Your Preprint Research with the World!
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2021-02-17 , DOI: 10.1109/tcpmt.2021.3057969
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2021-02-17 , DOI: 10.1109/tcpmt.2021.3057969
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
中文翻译:
TechRxiv:与世界分享您的预印本研究!
请准作者提交未出版的新手稿,以将其纳入本征文通知中所述的即将发生的事件中。
更新日期:2021-02-19
中文翻译:
TechRxiv:与世界分享您的预印本研究!
请准作者提交未出版的新手稿,以将其纳入本征文通知中所述的即将发生的事件中。