How to realize the high value-added utilization of scrap copper from e-waste is a meaningful topic. In the study, an Ohno Continuous Casting (OCC) process is an existing method you applied to purify the copper. Based on the model of diffusion-controlled grain growth kinetics, the redistribution of impurity of tin in the scrap copper were studied under the different continuous casting speed and mold temperature. On the centerline, macrosegregation in the axial direction of the tin was more obvious with the decrease of continuous casting speed. The small continuous casting rate was beneficial to the segregation and enrichment of tin. The axial segregation gradually decreased with the increase of the mold temperature. The flattening of the liquid–solid interface resulted in a weakening of the solute enrichment at the root of the interface with the increase of temperature. Morphology, electron backscattered diffraction (EBSD) analysis showed the structure of single crystal copper. The range of resistance of single crystal copper was from 5 × 10^-6 to 3 × 10^-5 Ω m. Obviously, the resistance of the single crystal copper was significantly smaller than that of ordinary copper wire (9.0 × 10^-3 Ω m). This study provided a key theoretical and practical basis for the high value-added reuse of copper in e-waste.

如何实现电子废弃物对废铜的高附加值利用是一个有意义的课题。在这项研究中，大野连铸（OCC）工艺是您用于纯化铜的现有方法。基于 在扩散控制晶粒长大动力学模型的基础上，研究了不同连铸速度和铸模温度下锡中铜中锡杂质的重新分布。在中心线上，随着连铸速度的降低，锡轴向的宏观偏析更加明显。较低的连续铸造速度有利于锡的分离和富集。随着模具温度的升高，轴向偏析逐渐减少。液固界面的扁平化导致随着温度的升高，在界面根部的溶质富集减弱。形态学，电子背散射衍射（EBSD）分析显示了单晶铜的结构。单晶铜的电阻范围为5×10^-6〜3×10 ^-5 Ω米。显然，单晶铜的电阻明显小于普通铜线的电阻（9.0×10 ^-3Ωm）。该研究为电子废料中铜的高附加值再利用提供了重要的理论和实践基础。