A wide variety of mechatronic products undergoes major changes to miniaturize them and integrate a larger number of functions. They require advanced technologies for their manipulation and assembly, that become even more challenging due to the different properties and tiny size of their components. Innovative devices are necessary to enable the automation of such operations, such as sorting and feeding systems able to singularize and deliver micro-parts precisely and reliably at high-speed. To this aim, an original “Store&Place device” was developed for micro-sphere singularization and deposition (Fontana et al., 2018) [3], based on the novel operating principle proposed in Fontana et al. (2017) [1]. A potential application of this device concerns the automatic rework of electronic components, more specifically the reballing of Ball Grid Array packages, that basically consists in restoring their electrical connection to the board by attaching new solder balls. When the release of a single solder ball is commanded, the device singularizes it from a storage of identical balls and places it onto the corresponding circular land on the package.

The paper presents the assessment of the device performance resulting from a structured experimental analysis on the manipulation of micro-spheres with diameter of 300 μm. It was applied to highlight the main process parameters influencing its performance, optimize them, and enhance the tool use. The performance indices to quantitatively evaluate the precision of the micro-sphere release were calculated according to Ruggeri et al. (2019) [5], and merged with other indices related to the reliability of the release and the time needed to execute it.

各种各样的机电产品进行了重大更改，以使它们小型化并集成大量功能。他们需要先进的技术来进行操作和组装，由于组件的不同属性和极小的尺寸，这些技术变得更具挑战性。创新的设备对于实现此类操作的自动化是必不可少的，例如能够精确，可靠地高速分离和输送微零件的分拣和进料系统。为此，基于Fontana等人提出的新颖操作原理，开发了一种原始的“ Store＆Place设备”，用于微球的单一化和沉积（Fontana等人，2018）[3]。（2017）[1]。该设备的潜在应用涉及电子元件的自动返工，更具体地说，是球栅阵列封装的重聚，基本上是通过连接新的焊球来恢复它们与电路板的电连接。当命令释放单个焊球时，该设备将单个焊球从存储相同的焊球中分离出来，并将其放置在包装上相应的圆形焊盘上。

本文介绍了通过对直径300μm的微球进行结构化实验分析得出的器件性能评估。它用于突出显示影响其性能的主要工艺参数，对其进行优化并增强工具的使用。根据Ruggeri等人的方法计算出定量评估微球释放精度的性能指标。（2019）[5]，并与其他与发布可靠性和执行时间相关的指标合并。