In machining operations, investigating the transformation between chip removal and ploughing is crucial to understand the material removal mechanism, which is also the basis for analyzing the machining process, such as calculating cutting force and predicting minimum uncut chip thickness (MUCT). In this study, an analytical model was proposed to predict the chip thickness and ploughing width for FCC crystal materials under arbitrary crystal orientations in nano-machining. The molecular dynamics (MD) simulation methods and the nano-scratching experiments were conducted to verify the theoretical model under two representative crystal orientations. The results indicate that the crystal orientation determines the transformation between chip removal and ploughing. Moreover, according to surface crystal orientation, machining direction, tool radius, and uncut chip thickness, the chip thickness and ploughing width can be calculated in nano-machining. The model can be applied to the nano-machining process of FCC crystals that achieve the plastic deformation by the (110){111} slip system, where tool size and uncut chip thickness are at the nanoscale.

在加工操作中，研究切屑去除和刨削之间的转换对于理解材料去除机理至关重要，这也是分析加工过程（例如计算切削力和预测最小未切屑厚度（MUCT））的基础。在这项研究中，提出了一个解析模型来预测纳米加工中任意晶体取向下FCC晶体材料的切屑厚度和犁削宽度。进行了分子动力学（MD）模拟方法和纳米划痕实验，以验证两种代表性晶体取向下的理论模型。结果表明，晶体取向决定了切屑去除和耕作之间的转换。此外，根据表面晶体取向，加工方向，刀具半径，对于未切屑的切屑厚度，可以在纳米加工中计算出切屑厚度和刨削宽度。该模型可以应用于通过（110）{111}滑移系统实现塑性变形的FCC晶体的纳米加工过程，其中刀具尺寸和未切屑厚度为纳米级。