This paper introduces a novel process for creating conductive copper traces on 3D surfaces from different additive manufacturing technologies by employing printed electronics techniques. An essential step in this process was the dip-coating pre-treatment with a primer to reduce the surface roughness below 100 nm, seal pores if present, and increase the thermal stability. This was followed by a dip-coating with copper nanoparticle ink, drying using a heat gun and thermal curing by laser sintering. The experiments determined the optimal laser peak intensity for achieving conductors with the lowest electrical resistance possible. The laser parameters’ processing window provided conductive traces on 3D surfaces with properties comparable to photonic sintering on planar substrates. Thereby, the conductive traces reached electrical specific resistances lower than 18 Ω cm (elemental copper: ρ = 1.8 Ω cm) and a copper material percentage higher than 90 atom %. Shear tests validated the assembly with surfacemount device (SMD) resistors. Electrical tests resulted in maximum current densities higher than 100 A mm⁻² and lateral breakdown voltages higher than 2kV mm⁻¹. Thus, this paper presents essential prerequisites for a future application of the technology.

本文介绍了一种通过采用印刷电子技术在不同增材制造技术的3D表面上创建导电铜迹线的新颖方法。此过程中的一个重要步骤是用底漆进行浸涂预处理，以降低表面粗糙度（低于100 nm），密封孔（如果存在）并提高热稳定性。接着用铜纳米颗粒油墨浸涂，使用热枪干燥并通过激光烧结进行热固化。实验确定了实现具有尽可能低电阻的导体的最佳激光峰值强度。激光参数的处理窗口在3D表面上提供了导电迹线，其性能可与在平面基板上进行光子烧结相媲美。从而，Ωcm（元素铜：ρ = 1.8Ωcm）和大于90原子％的铜材料百分比。剪切测试验证了使用表面贴装设备（SMD）电阻器进行的组装。电气测试导致最大电流密度高于100 A mm ^-2，横向击穿电压高于2kV mm ^-1。因此，本文提出了该技术未来应用的必要前提。