The dimension of $20\times 20\times15$ mm ³ has been selected as standard pixelated CdZnTe detector size for many years. Energy resolution of 0.31% full-width at half-maximum (FWHM) at 662 keV for single-pixel events was achieved in one of the best direct-attachment detectors based on VAD_UM v2.2 application-specific integrated circuit (ASIC). Energy resolution under 0.40% was obtained for most of the direct-attachment detectors. The consistent good performance drives the desire to build larger crystals. The increment of size is beneficial in many aspects, such as higher detection efficiency, better imaging performance, better spectroscopic resolution, and potentially lower cost. This article presents the performance of recently delivered $40\times 40\times10$ and $40\times 40\times15$ -mm ³ CdZnTe crystals manufactured by Redlen Technology and Kromek Group. The result will be analyzed and the feasibility of mass producing $40\times40$ -mm ² crystals will be discussed.

中文翻译：

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大容量40×40×10和40×40×15mm³CdZnTe检测器的性能

的尺寸 $ 20 \次20 \次15 $ 多年来，mm ³被选作标准像素化CdZnTe检测器尺寸。在基于VAD_UM v2.2专用集成电路（ASIC）的最佳直接连接检测器之一中，对于单像素事件，在662 keV处，半峰全宽（FWHM）的能量分辨率为0.31％。大多数直接连接探测器的能量分辨率均低于0.40％。始终如一的良好性能促使人们渴望制造更大的晶体。尺寸的增加在许多方面都是有益的，例如更高的检测效率，更好的成像性能，更好的光谱分辨率以及潜在地更低的成本。本文介绍了最近交付的性能 $ 40 \次40 \次10 $ 和 $ 40 \次40 \次15 $ Redlen Technology和Kromek Group生产的 -mm ³ CdZnTe晶体。分析结果并进行批量生产的可行性 40美元/次40美元 -mm ²晶体将被讨论。