To meet the upcoming challenges of higher power density and higher efficiency for power electronics, a system level approach to the design of power electronic devices must be carried out. Higher system integration and packaging will allow for more compact designs but will also result in challenges for component manufacturing and thermal management. Additive manufacturing can potentially mitigate some of these challenges due to the design flexibility and intricate features that additive manufacturing methods can provide. This paper presents an overview of the additive manufacturing technologies currently in practice at the academic and industry level. A detailed review is presented of current applications of additive methods for the production of power electronic components, advanced heat exchanger designs and integrated power electronic systems.

中文翻译：

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电力电子增材制造的当前和潜在应用

为了应对电力电子设备更高功率密度和更高效率的挑战，必须执行系统级方法来设计电力电子设备。更高的系统集成度和封装度将允许更紧凑的设计，但也会给组件制造和热管理带来挑战。由于增材制造方法可以提供的设计灵活性和复杂功能，增材制造可以潜在地缓解其中的一些挑战。本文概述了目前在学术和行业层面上正在实践的增材制造技术。详细介绍了添加剂方法在电力电子组件，先进的热交换器设计和集成电力电子系统生产中的当前应用。