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High-temperature wetting behavior of molten Ni-based superalloy on Y2O3 ceramics with different surface microstructures
Journal of Materials Processing Technology ( IF 6.7 ) Pub Date : 2021-02-10 , DOI: 10.1016/j.jmatprotec.2021.117094
Qingling Li , Huarui Zhang , Ming Gao , Jinpeng Li , Hu Zhang

To clarify the reaction between molten alloy and ceramic shell in the process of investment casting and control the metallurgical quality of alloy, high-temperature wetting experiments of Ni-based superalloy melt on Y2O3 ceramics with different surface microstructures were carried out. The high-temperature wettability and interfacial interactions at 1873 K between Ni-based superalloy melt and Y2O3 ceramics were studied in the present paper. The results showed that the apparent equilibrium contact angle of alloy melt on the substrate firstly decreases from 90.8° to 75.9° and then increases to 87.7°, with the surface roughness of Y2O3 ceramic substrate changed from 0.859 μm to 2.253 μm. The contact conditions between melts and substrates are in accordance with the Wenzel equation, with the surface roughness of ceramic substrate varied between 0.859 μm and 1.311 μm. When that of the substrate continuously increased from 1.311 μm to 2.253 μm, the contact conditions between alloy melts and substrates were in accordance with the Cassie Baxter equation. Based on component analysis, it was found Al aggregated at the interface between Y2O3 ceramics and alloy melts, resulting in the formation of Y4Al2O9 and the change of surface tension of the alloy droplet in the process of high temperature wetting. Proper surface microstructure of the ceramic shell can ensure that the melt has enough filling ability and reduce the melt pollution caused by the reaction between melt and ceramic.



中文翻译:

镍基高温合金在不同表面微观结构的Y 2 O 3陶瓷上的高温润湿行为

为了阐明熔模铸造过程中熔融合金与陶瓷壳之间的反应,控制合金的冶金质量,进行了镍基高温合金熔体在不同表面微观结构的Y 2 O 3陶瓷上的高温润湿实验。本文研究了镍基高温合金熔体与Y 2 O 3陶瓷在1873 K下的高温润湿性和界面相互作用。结果表明,随着Y 2 O 3表面粗糙度的增大,合金熔体在基体上的表观平衡接触角从90.8°减小到75.9°,然后增加到87.7°。陶瓷基板从0.859μm更改为2.253μm。熔体与基材之间的接触条件符合Wenzel方程,陶瓷基材的表面粗糙度在0.859μm至1.311μm之间变化。当基材的接触强度从1.311μm连续增加到2.253μm时,合金熔体与基材之间的接触条件符合Cassie Baxter方程。根据成分分析,发现Al聚集在Y 2 O 3陶瓷和合金熔体之间的界面上,导致形成Y 4 Al 2 O 9。高温润湿过程中合金液滴表面张力的变化。陶瓷壳体的适当的表面微观结构可以确保熔体具有足够的填充能力,并减少由熔体与陶瓷之间的反应引起的熔体污染。

更新日期:2021-02-26
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