Purpose

In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic devices to bridge the topologies that exists between a heat sink and the flip chip assembly. Therefore, this study aims to investigate the reliability of SAC405 and SAC396 in a microelectronics assembly.

Design/methodology/approach

In this paper, SnAgCu solder alloys (SAC405 and SAC396) were used as the TIMs. The model, which comprises the chip, TIM and heat sink base, was developed with ANSYS finite element analysis software and simulated under a thermal cycling load of between −40°C and 85°C.

Findings

The results obtained from this paper were based on the total deformation, stress, strain and fatigue life of the lead-free solder materials. The analyses of the results showed that SAC405 is more reliable than SAC396. This was evident in the fatigue life analysis where it was predicted that it took about 85 days for SAC405 to fail, whereas it took about 13 days for SAC396 to fail. Therefore, SAC405 is recommended as the TIM of choice compared to SAC396 based upon the findings of this investigation.

Originality/value

This paper is centred on SnAgCu solders used as TIMs. This paper demonstrated that SAC405 is a reliable solder TIM. This can guide manufacturers of electronic products in deciding which SAC solder to apply as TIM during the assembly process.

中文翻译：

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微电子中SnAgCu无铅焊料热界面材料的可靠性分析

目的

在微电子行业，其组件的可靠性是工程师们关注的主要领域。因此，必须使用最可靠的材料来解决这些问题。热界面材料 (TIM) 用于电子设备以桥接散热器和倒装芯片组件之间的拓扑结构。因此，本研究旨在研究 SAC405 和 SAC396 在微电子组件中的可靠性。

设计/方法/方法

在本文中，SnAgCu 焊料合金（SAC405 和 SAC396）用作 TIM。该模型包括芯片、TIM 和散热器底座，使用 ANSYS 有限元分析软件开发，并在 -40°C 至 85°C 之间的热循环负载下进行模拟。

发现

从这篇论文中获得的结果是基于无铅焊料材料的总变形、应力、应变和疲劳寿命。结果分析表明，SAC405 比 SAC396 更可靠。这在疲劳寿命分析中很明显，其中预测 SAC405 需要大约 85 天才能失效，而 SAC396 需要大约 13 天才能失效。因此，根据本次调查的结果，与 SAC396 相比，推荐 SAC405 作为首选 TIM。

原创性/价值

本文主要讨论用作 TIM 的 SnAgCu 焊料。本文证明了 SAC405 是一种可靠的焊料 TIM。这可以指导电子产品制造商在组装过程中决定使用哪种 SAC 焊料作为 TIM。