Intimate integration of photonics with electronics is regarded as the key to further improvement in bandwidth, speed and energy efficiency of information transport systems. Here, a method based on wafer-scale polymer bonding is reviewed which is compatible with foundry-sourced high-performance InP photonics and BiCMOS electronics. We address challenges with respect to circuit architecture, co-simulation framework and interconnect technology and introduce our approach that can lead to broadband high-density interconnects between photonics and electronics. Recent proof-of-concept work utilizing DC-coupled driver connections to modulators, which significantly reduces the interconnect complexity, is summarized. Furthermore, co-simulation concepts based on equivalent circuit models are discussed with emphasis on the importance of impedance matching between driver and modulator. Finally, realizations of broadband interconnects and functional photonic building blocks after wafer bonding are highlighted to demonstrate the potential of this wafer-scale co-integration method.

中文翻译：

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致力于将InP光子学与硅电子技术集成：设计和技术挑战

光子学与电子学的紧密集成被认为是进一步提高信息传输系统的带宽，速度和能效的关键。在此，对基于晶圆级聚合物键合的方法进行了综述，该方法与代工厂生产的高性能InP光子学和BiCMOS电子学兼容。我们解决了电路架构，协同仿真框架和互连技术方面的挑战，并介绍了可以导致光子学与电子学之间实现宽带高密度互连的方法。总结了最近的概念验证工作，该工作使用了直流耦合的驱动器连接到调制器，从而大大降低了互连的复杂性。此外，讨论了基于等效电路模型的协同仿真概念，并着重强调了驱动器和调制器之间阻抗匹配的重要性。最后，重点介绍了晶片键合后宽带互连和功能性光子构建模块的实现，以证明这种晶片级共集成方法的潜力。